4-2013620-4 datasheet

Маркировка

4-2013620-4
Производитель

TE Connectivity
Описание

TE Connectivity 4-2013620-4 Application: Production Assembly Process Feature: Pick and Place Cover, Tape Chip Compatibility: Intel?® Core?„? rPGA988A Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (15) Contact Style: Stamped + Formed Cover Color: Black Cover Material: High Temperature Thermoplastic Frame Style: Open Grid Size: 35x36 Grid Spacing (mm [in]): 1.00 x 1.00 [.039 x .039] Heat Sink Attachment: Without Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Force: ZIF Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Leg Style: Ball Grid Array (BGA) Number Of Positions: 988 Packaging Method: Tape Mounted on Reel Packaging Quantity: 120 Pcb Mount Style: Surface Mount Profile: Low Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Socket Identifier: rPGA989 Ul Flammability Rating: UL 94V-0 Zif Actuator: Screwdriver/Cam
Количество страниц

1 шт.
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PDF
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250,49 KB